回收MAXIM美信芯片IC
封装类型ASSOP (缩小外形封装) 209 mil (14, 16, 20, 24, 28引脚)；300 mil (36引脚)BUCSP (超小型晶片级封装)C塑料TO-92；TO-220CLQFP 1.4mm (7mm x 7mm 过孔 20mm x 20mm)CTQFP 1.0mm (7mm x 7mm 过孔 20mm x 20mm)D陶瓷Sidebraze 300 mil (8, 14, 16, 18, 20引脚)；600 mil (24, 28, 40, 48引脚)EQSOP (四分之一小外型封装)F陶瓷扁平封装G金属外壳(金)GQFN (塑料、薄型、四边扁平封装，无引脚冲压) 0.9mmHSBGA (超级球栅阵列)HTQFP 1.0mm 5mm x 5mm (32引脚)HTSSOP (薄型缩小外形封装) 4.4mm (8引脚)JCERDIP (陶瓷双列直插) (N) 300 mil (8, 14, 16, 18, 20引脚)；(W) 600 mil (24, 28, 40引脚)KSOT 1.23mm (8引脚)LLCC (陶瓷无引线芯片载体) (18, 20, 28引脚)LFCLGA (倒装芯片、基板球栅阵列)；薄型LGA (薄型基板球栅阵列) 0.8mmLµDFN (微型双列扁平封装，无引线) (6, 8, 10引脚)MMQFP (公制四边扁平封装)高于1.4mm；ED-QUAD (28mm x 28mm 160引脚)NPDIP (窄型塑料双列直插封装) 300 mil (24, 28引脚)PPDIP (塑料双列直插封装) 300 mil (8, 14, 16, 18, 20引脚)；600 mil (24, 28, 40引脚)QPLCC (塑料陶瓷无引线芯片载体)RCERDIP (窄型陶瓷双列直插封装) 300 mil (24, 28引脚)SSOIC (窄型塑料小外形封装) 150 milT金属外壳(镍)TTDFN (塑料、超薄、双列扁平封装，无引线冲压) 0.9mm (6, 8, 10 & 14引脚)T薄形QFN (塑料、超薄、四列扁平封装，无引线冲压) 0.8mmTQ薄形QFN (塑料、超薄、四列扁平封装，无引线冲压) 0.8mm (8引脚)USOT 1.23mm (3, 4, 5, 6引脚)UTSSOP (薄型缩小外形封装) 4.4mm (14, 16, 20, 24, 28, 38, 56引脚)；6.1mm (48引脚)UµMAX (薄型缩小外形封装) 3mm x 3mm (8, 10引脚)VU. TQFN (超薄QFN - 塑装、超薄四边扁平，无引线冲压) 0.55mmWSOIC (宽型、塑料小外形封装) 300 milWWLP (晶片级封装)XCSBGA 1.4mmXCVBGA 1.0mmXSC70YSIDEBRAZE (窄型) 300 mil (24, 28引脚)，超薄LGA 0.5mmZ薄型SOT 1mm (5, 6, 8引脚)
